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PCBA Sample

Delivery term:The date of payment from buyers deliver within days
  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Beijing

  • Validity to:

    Long-term effective

  • Last update:

    2017-09-11 10:03

  • Browse the number:

    204

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Company Profile
Shenzhen Mingyangxing Electronics Co.,Ltd
By certification [File Integrity]
Contact:

myx008(Mr.)  

Email:

Telephone:

Area:

Beijing

Address:

No.221 Shenshan Road, Pingshan Street, Pingshan New District, Shenzhen

Website: http://www.assembly-pcbs.com/ http://www.slpdiggers.com/com/myx008/
Product details

TYPE:

PCBA sample

PCB layers

1~32 layers

Max working panel area

457*610MM

Min boartd tinckness

4 Layer:0.4MM/6 Layer:0.8MM/8 Layer:1.0MM/10 Layer:1.2MM

Insulation resistance

1E+12R(normal condition)

DIP service

resistance/ capacitance/diode/transistor/ IC / IC socket.etc.

SMT service

0201/0402/0603/1206/particularity,etc

Test type

Available on request

Casing material

Metals/plastic/custom-made

Business Type:

Manufacturers

Place of Origin

Shenzhen,China

Packing
Standard export packing:
1.Standard :antistatic bays ,vacuum package,customized package.
2.Standard:K=K carton

Delivery time: 3~5 days after receipt deposit

Sample Services :
Pcb assembly : SMT/RTH/Inspect
Pcba and pcb design
Components sourcing and purchasing
Quick prototyping
Plastic inection molding
Metal sheet stamping/die casting
Final assembly
Test: AOI ,In-Circuit Test,Functional Test
Requested information for pcb assembly
1.Gerber file of the bare pcb board
2.BOM for assembly(bill of material)
3.Testing Guide & Test file
4.Programming files&programming file
5.Schematic if necessary
6.Clear Pic. Of PCB or PCBA sample if available
ontract Printed Circuit Board (PCB) Assembly Services Specifications 

Category

Description

Capability

SMT Capability

Qty of SMT Line

5

SMT Capacity

35 Millions Per Day

Max Board Size

457mm × 610mm

Min. Coponent Size

0201

BGA/μBGA 

Available

DIP Capability

Qty of DIP Line

3

DIP Capacity

0.2 Millions Per Day

Max Board Width

400 mm

Lead-free Line

Available

Max. Degree

399 °C

Spray Flux Add-on

Available

Technical Data

Stencil Size

736mm × 736mm

Min. IC Pitch

0.3mm

Max. IC Size

50mm

Max. PCB Size

1200mm × 500mm

Min. PCB Thickness

0.35mm

Min. Chip Size

0201

Max. BGA Size

74mm × 74mm

BGA Ball Pitch

Min. : 1.0mm  Max. : 3.0mm

BGA Ball Diameter

Min. :  0.4 mm  Max. : 1.0mm

OFP Lead Pitch

Min. :  0.38 mm  Max. : 2.54mm

Turn Times

Quick turn are our specialty

Assembly Type

Surface Mount(SMT) Assembly

Thru-Hole Assembly

Mixed(Surface Mount and Thru-Hole)

Cable Assembly

Box Build Assembly

Technical Data

Stencil

Laser Cut Stainless Steel

Part Procurements

Turnkey(We supply the Part)

Consigned(You Supply the Parts)

You Supply some part,we do the rest

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